cooper bussmann

42510ESDA-TR1 PolySurg™ Four-Channel ESD Suppressor


The Cooper Bussmann® PolySurg™ 42510ESDA four-channel array ESD suppressor protects sensitive electronic circuits from the threat of electrostatic discharge (ESD) without distorting data signals. This protection is a result of its ultra-low capacitance (0.1pF typical) that is well suited for HDMI ESD protection applications.
• Halogen free, lead free and RoHS compliant for global applications
• Ultra-low capacitance (0.1pF typical) ideally suited for protecting high speed data applications
• Provides ESD protection with fast response time (<1ns) allowing equipment to pass the IEC 61000-4-2 Level 4 test
• Four (4) channel array
• Zero signal distortion
• Low leakage current (<0.01µA typical)

Applied to a high speed signal interface, the 42510ESDA protects:
• Digital video equipment
• Mobile phone
• GPS Antenna
• Bluetooth communication equipment antenna circuit
• IEEE-1394
Part Numbering System:

• Supplied in tape and reel packaging, 5000 parts per seven inch (178mm) reel per EIA Standard 481-1
Ordering Information
Catalog Number Description
42510ESDA-TR1 5000 suppressors in paper tape on a 7 inch
(178mm) reel

Electrical Specifications
Characteristic Value/Range
Rated Voltage (max) 12V
Leakage Current (max @ 12Vdc) 0.01μA
Trigger Voltage (Vt) 300V Typical
Clamping Voltage (Vc) 30V Typical
Capacitance  (Cp) @1MHz* 0.1pF Typical
Response Time <1ns
ESD Voltage Capability,  IEC 61000-4-2
Contact Discharge Mode
ESD Voltage Capability,  IEC 61000-4-2
Air Discharge Mode
ESD Withstand Pulses 100 Times Minimal
* Note, Capacitance measured with 1Vrms

Environmental Specifications
Characteristic Value
Load Humidity +85°C/90%RH with rated voltage for 1000 hrs
Thermal Shock -40°C to +85°C, 30 minute cycle, 5 cycles
Moisture Resistance Test J-STD-020 Standard: Level 2
(1 year floor life under 30°C/65%RH conditions
Operating Temperature Range -40°C to +85°C (-40°F to 185°F)
Storage Temperature Range -55°C to +125°C (-67°F to +257°F)

Soldering Recommendations
• Compatible with lead and lead-free solder reflow processes
• Hand soldering - soldering tip should not directly touch part - 280°C max for 3 sec. max
• Peak reflow temperatures and durations:
- IR Reflow = 260°C max for 20 sec. max
- Wave Solder = 260°C max for 10 sec. max
Recommended IR Reflow Profile

Design Considerations
• Follow the soldering recommendations to avoid deforming product
• Do not use high temperature, high humidity or corrosive atmospheres(sulfide and chloride gas) that could damage the solderability
• Moisture Sensitivity Level (MSL) according to J-STD-020 standard: Level 2 (Floor Life 1 year under <30°C/65%RH conditions)
• Solderability requirement according to IPC/JEDEC J-STD-002C, Test D, Test B1
• Use Sn/Ag/Cu (96.5/3.0/0.5) or equivalent solder and activated flux #5 or equivalent.

Circuit Schematic

HDMI Application

Dimensions - mm

Recommended Pad Layout - mm

Tape and Reel Packaging Specifications - mm


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