Description
• Halogen free
• 125°C maximum total temperature operation
• 8.5 x 7.0 x 7.2mm surface mount package
• Ferrite core material
• High current carrying capacity
• Low core losses
• Controlled DCR tolerance for sensing circuits
• Inductance range from 72nH to 190nH
• Current range from 37 to 90 amps
• Frequency range up to 2MHz
• RoHS compliant
Applications
• Multi-phase regulators
• Voltage Regulator Module (VRM)
• Point of load modules
• Servers and workstations
• Data networking and storage systems
• Notebook and desktop computers
• Graphics cards and battery power systems
• DCR sensing
Environmental Data
• Storage temperature range: -40°C to +125 °C
• Operating temperature range: -40°C to +125°C (Range is application specific)
• Solder reflow temperature: J-STD-020D compliant
Packaging
• Supplied in tape and reel packaging, 640 parts per reel,13” diameter reel
Product Specifications
Product Specifications
| Part Number | OCL1 ± 10% (nH) | FLL2 Min. (nH) | Irms3 (Amps) | Isat14 @ 25°C (Amps) | Isat25 @ 125°C (Amps) | DCR (mΩ) @ 20°C | K-factor6 |
| FP0708R1-R07-R | 72 | 52 | 44 | 90 | 72 | 0.35 ± 8.6% | 557 |
| FP0708R1-R09-R | 90 | 64 | 75 | 60 | 557 | ||
| FP0708R1-R10-R | 105 | 75 | 68 | 54 | 557 | ||
| FP0708R1-R12-R | 120 | 86 | 59 | 47 | 557 | ||
| FP0708R1-R15-R | 150 | 108 | 47 | 37 | 557 | ||
| FP0708R1-R19-R | 190 | 135 | 37 | 29 | 557 |
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1
3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application.
4 Isat1: Peak current for approximately 20% rolloff at +25°C.
5 Isat2: Peak current for approximately 20% rolloff at +125°C.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3, Bp-p : (Gauss), K: (K-factor from table), L: (inductance in nH),ΔI (peak-to-peak ripple current in amps).
7 Part Number Definition: FP0708Rx-Rxx-R
• FP0708 = Product code and size
• Rx is the DCR indicator
• Rx is the DCR indicator
• Rxx= Inductance value in μH, R = decimal point
• “-R” suffix = RoHS compliant
Dimensions - mm A = 7.0 Max. B = 8.5 Max. C = 7.2 Max. D = 2.1 ± 0.15 E = 1.52 ± 0.2 F = 3.6 Typ.
Packaging Information - mm
Temperature Rise vs.Total Loss
Core Loss
• “-R” suffix = RoHS compliant
Dimensions - mm A = 7.0 Max. B = 8.5 Max. C = 7.2 Max. D = 2.1 ± 0.15 E = 1.52 ± 0.2 F = 3.6 Typ.
Packaging Information - mm
Temperature Rise vs.Total Loss
Inductance Characteristics
Core Loss
Solder Reflow Profile
Reference JDEC J-STD-020D
| Profile Feature | Standard SnPb Solder | Lead (Pb) Free Solder | |
| Preheat and Soak | • Temperature min. (Tsmin) | 100°C | 150°C |
| • Temperature max. (Tsmax) | 150°C | 200°C | |
| • Time (Tsmin to Tsmax) (ts) | 60-120 Seconds | 60-120 Seconds | |
| Average ramp up rate Tsmax to Tp | 3°C/ Second Max. | 3°C/ Second Max. | |
| Liquidous temperature (TL) Time at liquidous (tL) |
183°C 60-150 Seconds |
217°C 60-150 Seconds |
|
| Peak package body temperature (TP)* | Table 1 | Table 2 | |
| Time (tp)** within 5 °C of the specified classification temperature (Tc) | 20 Seconds** | 30 Seconds** | |
| Average ramp-down rate (Tp to Tsmax) | 6°C/ Second Max. | 6°C/ Second Max. | |
| Time 25°C to Peak Temperature | 6 Minutes Max. | 8 Minutes Max. | |
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