cooper bussmann

FP1005 Series Flat-Pac™ High Current High Frequency Low-Profile Power Inductors

  

Description
• Halogen free
• 125°C maximum total temperature operation
• 10.2 x 7.0 x 4.95mm surface mount package
• Ferrite core material
• High current carrying capacity, Low core losses
• Controlled DCR tolerance for sensing circuits
• Inductance range from 85nH to 220nH
• Current range from 33 to 90 amps
• Frequency range up to 2MHz
• RoHS compliant
 
Applications
• Multi-phase regulators
• Voltage Regulator Module (VRM)
• Point-of-load modules
• Desktop and server VRMs and EVRDs
• Data networking and storage systems
• Notebook regulators
• Graphics cards and battery power systems
• DCR sensing
 
Environmental Data
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C (Range is application specific)
• Solder reflow temperature: J-STD-020D compliant
 
Packaging
• Supplied in tape and reel packaging, 950 parts per reel, 13” dia. reel

Product Specifications
Part Number7 OCL1  ± 10% (nH) FLL2 Min. (nH) Irms3  (Amps) Isat14  @ 25°C (Amps) Isat25  @ 125°C (Amps) DCR (mΩ) @ 20°C K-factor6
R1 Version
FP1005R1-R08-R 85 61 53 90 64 0.39 ± 7.7% 536
FP1005R1-R10-R 100 72 73 57 536
FP1005R1-R12-R 120 86 60 48 536
FP1005R1-R15-R 150 108 47 37 536
FP1005R1-R22-R 220 158 33 26 536
R2 Version
FP1005R2-R08-R 85 61 50 90 64 0.47 ± 6.7% 536
FP1005R2-R10-R 100 72 73 57 536
FP1005R2-R12-R 120 86 60 48 536
FP1005R2-R15-R 150 108 47 37 536
FP1005R2-R22-R 220 158 33 26 536
R3 Version
FP1005R3-R08-R 85 61 45 90 64 0.55 ± 5.4% 536
FP1005R3-R10-R 100 72 73 57 536
FP1005R3-R12-R 120 86 60 48 536
FP1005R3-R15-R 150 108 47 37 536
FP1005R3-R22-R 220 158 33 26 536
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1
3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat-generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application.
4 Isat1: Peak current for approximately 20% rolloff at +25°C.
5 Isat2: Peak current for approximately 20% rolloff at +125°C.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3, Bp-p : (Gauss), K: (K-factor from table), L: (inductance in nH),ΔI (peak-to-peak ripple current in amps).
7 Part Number Definition: FP1005Rx-Rxx-R
• FP1005 = Product code and size
• Rx is the DCR indicator
• Rxx= Inductance value in μH, R = decimal point
• “-R” suffix = RoHS compliant
 
Dimensions - mm 

Packaging Information - mm


Temperature Rise vs.Total Loss


Core Loss


Inductance Characteristics


Solder Reflow Profile


Reference JDEC J-STD-020D
Profile  Feature Standard  SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C
• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin to Tsmax) (ts) 60-120  Seconds 60-120  Seconds
Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (TL) Time at liquidous (tL) 183°C
60-150  Seconds
217°C
60-150  Seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds**
Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.

----------------------------------
Bussmann规格资料查询
Bussmann产品规格类型
或许您会感兴趣...
联系客服
深圳市博孚美科电子有限公司
总机: 0755-82862885, 82862629
传真: 总机 转 801
邮箱: service@bussmann.net.cn
网址: http://www.bussmann.net.cn
资料中心: http://bm-bussmann.com