FP1108 Series High Frequency High Current Power Inductors - 伊顿EATON BUSSMANN产品资料中心

Product description

• Halogen free, lead free, RoHS compliant

• 125°C maximum total temperature operation

• 11.0 x 8.0 x 7.5mm maximum surface mount package

• Ferrite core material

• Controlled DCR for sensing circuits

• Inductance range from 100nH to 210nH

• Current range from 55 to 100+ amps

Applications

• Multi-phase regulators

• Voltage Regulator Modules (VRMs)

• Desktop and server VRMs and EVRDs

• Notebook regulators

• Data networking and storage systems

• Graphics cards and battery power systems

• Point-of-Load modules

• DCR Sensing circuits

Environmental data

• Storage temperature range (Component): -40°C to +125 °C

• Operating temperature range: -40°C to +125°C (ambient + self-temperature rise)

• Solder reflow temperature: J-STD-020D compliant

Packaging

• Supplied in tape and reel packaging, 500 parts per 13” reel

Product specifications

Part Number	OCL' !nH) .10%	F llmin. 2 !nH)	nsp3 {Alm s}	{Aml t1p4 s}	(AImM2p5 s}	{Alma3p6 s}	4p7 {Alm s}	DCR (mrl)@200 C	K facto.-s
FP1108R1-R10-R	100	81	65	100+	96	94	90	0.295%	330
FP1108R1-R15-R	150	110		77	72	66	63		330
FP1108R1-R18-R	180	132		65	61	58	50		330
FP1108R1-R21-R	210	151		55	51	48	45		330

1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, 25°C

2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1

3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application.

4. Isat1 : Peak current for approximately 20% (R10 10%) rolloff @ +25°C (R10 10%)

5. Isat2: Peak current for approximately 20% (R10 10%) rolloff @ +85°C

6. Isat3 : Peak current for approximately 20% (R10 10%) rolloff @ +100°C

7. Isat4: Peak current for approximately 20% (R10 10%) rolloff @ +125°C

8. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in µH), ∆I (peak to peak ripple current in amps).

9. Part Number Definition: FP1108Rx-yyy-R

- FP1108Rx = Product code and size

- Rx = DCR indicator

- yyy= Inductance value in µH

- “-R” suffix = RoHS compliant

Dimensions - mm

DCR measured from point “A” to point “B”

Part marking: FP1108R1 (Product code and size), xxx = Inductance value in µH, wwllyy= date code, R= revision level

Tolerances are ±0.15 millimeters unless stated otherwise

PCB tolerances are ±0.1millimeters unless otherwise specified.

All soldering surfaces to be be coplanar within 0.1 millimeters.

Termination finish: matte Sn with Ni underplate

Packaging information - mm

Temperature rise vs. total loss

Core loss

Inductance characteristics

Solder reflow profile

Reference JDEC J-STD-020D

Profile Feature		Standard SnPb Solder	Lead (Pb) Free Solder
Preheat and Soak	• Temperature min. (Tsminl	100°C	150 °C
	• Temperature max. (Tsmax)	150 °C	200 °C
	• Time (Tsmin to Tsmax) tts)	60-120 Seconds	60-120 Seconds
Average ramp up rate Tsmax to Tp		3 C/ Second Max.	3 C/ Second Max.
Liquidous temperatureσL) Time at liquidous (tL)		183 °C 60-150 Seconds	217 °C 60-150 Seconds
Peak package body temperature (TP)*		Table 1	Table 2
Time (tp) within 5 °C of the specified classification temperatureσc)		20 Seconds	30 Seconds
Average ramp-down rateσP to Tsmax)		6 C/Second Max.	6 C/ Second Max.
Time 25°C to Peak Temperature		6 Minutes Max.	8 Minutes Max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.