Description
The Cooper Bussmann PolySurg™ 0402ESDA-MLP1 ESD Suppressors protect valuable high-speed data circuits from ESD damage without distorting data signals as a result of its ultra-low (0.05pF typical) capacitance.
Features
• Halogen free
• RoHS compliant for global applications
• Lead free
• Ultra-low capacitance (0.05pF typ.) ideal for high speed data applications
• Provides ESD protection with fast response time (<1ns) allowing equipment to pass IEC 61000-4-2 level 4 test
• Single-line, bi-directional device for placement flexibility
• Low profile 0402/1005 design for board space savings
• Low leakage current (<0.1nA typ.) reduces power consumption
• (Sn) Tin-plated version available
Applications
• Computers and peripherals
• HDTV Equipment
• DVD Players
• A/V Equipment
• Satellite radio
• Cell phones
• PDAs
• Digital still cameras
• Digital camcorders
• MP3/Multimedia players
• Set top boxes
• External storage
• DSL Modems
• High speed data ports
• USB 2.0/3.0
• IEEE 1394b
• HDMI 1.3
• DVI
• High speed ethernet
• Infiniband®
Specifications
Specifications
| Characteristic | Value | |
| Rated Voltage | 30Vdc maximum | |
| Clamping Voltage1 | 35V typical | |
| Trigger Voltage2 | 300V typical | |
| Capacitance (@1MHz) | 0.05pF typical, 0.15pF maximum | |
| Attenuation Change (0-6GHz) | -0.2dB typical | |
| Leakage Current (@12Vdc) | <0.1nA typical | |
| ESD Capability | ||
| • IEC61000-4-2 Direct Discharge | 8kV typical | |
| • IEC61000-4-2 Air Discharge | 15kV typical | |
| ESD Pulse Withstand3 | >1000 typical | |
1 Per IEC61000-4-2, Level 4 waveform (8kV direct, 30A) measured 30ns after initiation of pulse.
2 Trigger measurement made using Transmission Line Pulse (TLP) method.
3 Minor shifting in characteristics may be observed over multiple ESD pulses at very rapid rate
Packaging
• 10,000 suppressors on paper tape in seven inch (178mm) plastic reel per EIA Standard 481-1.
Ordering Information
| Catalog Number | Description |
| 0402ESDA-MLP1 | 10,000 pieces on paper tape on 7" (178mm) reel - tin plating |
Design Considerations
The location in the circuit for the MLP series has to be carefully determined. For better performance, the device should be placed as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD event, it is recommended to use a “0-stub” pad design (pad directly on the signal/data line and second pad directly on common ground).
Environmental Specifications
Environmental Specifications
| Characteristic | Value |
| Load Humidity |
12Vdc per EIA/IS-772 Para. 4.4.2, +85°C, 85% RH for 1000 hours |
| Thermal Shock |
EIA/IS-722 Para 4.6, Air-to-Air -55°C to +125°C, 5 cycles |
| Moisture Resistance Test | MIL-STD-202G Method 106G, 10 cycles |
| Mechanical Shock | EIA/IS-722 Para. 4.9 |
| Vibration | EIA/IS-722 Para. 4.10 |
| Resistance to Solvent | EIA/IS-722 Para. 4.11 |
| Operating Temperature Range | -55°C to +125°C |
| Storage Temperature Range | -55°C to +125°C |
Soldering Recommendations
• Compatible with lead and lead-free solder reflow processes
• Peak reflow temperatures and durations:
- IR Reflow = 260°C max for 10 sec. max.
- Wave Solder = 260°C max. for 10 sec. max.
• Recommended IR Reflow Profile:
Dimensions - in (mm)
Recommended Pad Layout - in (mm)
Tape and Reel Specifications - mm
Dimensions - in (mm)
Recommended Pad Layout - in (mm)
Tape and Reel Specifications - mm
总机: 0755-82862885, 82862629
传真: 总机 转 801
邮箱: service@bussmann.net.cn
网址: http://www.bussmann.net.cn
资料中心: http://bm-bussmann.com