cooper bussmann

CC06H Series High I2t Chip™ 0603 size fuses

  

Description:
The Chip™ CC06H Series high I2t fuse is a very small surface mount fuse (0603 size) designed to protect low voltage circuits from the harmful effects of short-circuits. The technology of this series combines the robust Bussmann solid matrix fuse construction with advanced fuse element design to deliver state-of-the-art overcurrent protection on circuits subject to inrush currents.
Halogen free, lead free and RoHS compliant
High inrush withstand capability
Fast-acting performance
Ampacity alpha mark on fuse for easy identification
Standard termination design for easy solderability
Compatible with standard lead-free solder reflow and wave soldering processes
Excellent environmental integrity

Applications
For secondary protection in space constrained applications such as:
LCD Backlight inverters
Digital cameras
DVD Players
Bluetooth headsets
Battery packs
 
Agency information
cURus Recognized Guide and Card JDXY2/JDYX8, File E19180
 
Packaging
TR - Packaging code suffix for tape-and-reel (8mm wide tape on 178mm diameter reel - specification EIA 481-1)
Quantity = 5000 fuses

Electrical characteristics
Amp Rating % of  Amp Rating Opening Time
1-8A 100 1 Hours
1-7A 200 1-60  Seconds
1-8A 250 5 Seconds  Max


Specifications
Catalog
Number
Amp
Rating5
Voltage
Rating
!Vdcl
Interrupting
Rating1 4
(amps)
Typical Cold
Resistance2
{ )
Typical Pre-Arcing3 (1 ) Typïcal Voltage Drop (mV) Typical Power Dissipation
(w)
Alpha
Marking
Agency Information (cURus)
CC06H1A 1A 32 50 0.25 0.02 310 0.32 B X
CC06H1.5A 1.5A 32 50 0.13 0.07 250 0.38 H X
CC06H2A 2A 32 50 0.068 0.14 170 0.38 K X
CC06H2.5A 2.5A 32 50 0.05 0.25 155 0.38 L X
CC06H3A 3A 32 50 0.035 0.3 130 0.38 O X
CC06H3.5A 4A 32 50 0.023 0.5 100 0.35 R X
CC06H4Ä 4A 32 50 0.02 0.8 110 0.45 S X
CC06H5Ä 5A 32 50 0.013 1.6 95 0.48 T X
CC06HA 6A 32 50 0.0076 2.6 80 0.48 V X
CC06H7A 7A 32 50 0.0056 3.3 80 0.56 X X
CC06H8A 8A 32/24 50/90 0.004 4.5 75 0.6 Z X
1. DC Interrupting Rating (measured at rated voltage, time constant of less than 50 microseconds, battery source).
2. DC Cold Resistance are measured at <10% of rated current in ambient temperature of 20°C -  FOR REFERENCE ONLY - CONTROLLED VALUES HELD BY PLANT AND SUBJECT TO CHANGE WITHOUT NOTICE.
3. Typical Pre-arcing I2t are measured at rated DC voltage, 10In current (not to exceed interrupting rating).
4. The insulation resistance after breaking capacity test is higher than 0.1MΩ when measured by 2X rated voltage.
5. Device designed to carry rated current for 4 hours minimum. An operating current 80% or less of rated current is recommended,  with further design derating required at elevated ambient temperature. See Temperature Derating Below Curve.

Time-current curves — average melt


I2t vs. time curves


I2t vs. current curves


Temperature derating curve


Dimensions - mm (in)


Pad layout


Product characteristics
Operating  temperature -400 C to 850C    with  proper derating factor applied
Storage temperature -400 C to 850C
Load humidity MIL-STD-202G   Method 103B (1000 hr @ 850C / 85%  RH & 10%  rated current)
Moisture resistance MIL-STD-202   Method 106E (50 cycles)
Thermal shock MIL-STD-202   Method 107D (-650C to + 1250 C  100 cycles)
Vibration test MIL-STD-202   Method 204D  Test Condition  D (10    000Hz)
Mechanical  shock resistance MIL-STD-202   Method 213B (3000G /0.3ms)
Salt spray resistance MIL-STD-202   Method 101  Test Condition  B (48 hr exposure)
Insulation  resistance The insulation  resistance after breaking capacity test is higher than 0.1 MW  when  measured  by 2X rated voltage
Solderability JESTD-002C Method B1(DlMp and Look Test)  Method G1(VVettlngBdance Test)  Method D(Reslstance to
Dissolution  / Dewetting of Metalization)
Resistance to soldering  heat MIL-STD-202   Method 21 OF (Solder dip - 2600 C  60 seconds / Solder Iron - 3500 C  3-5 seconds)
High temperature life test MIL-STD-202G   Method 108A (1000 Hours @ 700 C & 60%  rated current)
Resistance to solvents MIL-STD-202.  Method 215K


Solder reflow profile


Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsminl 100°C 150°C
• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin  to Tsmax)  tts) 60-120 Seconds 60-120 Seconds
Average ramp up rate Tsmax to Tp 3°C/ Second  Max. 3°C/ Second  Max.
Liquidous temperatureσL)
Time at liquidous (tL)
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperatureσp) Table 1 Table 2
Time (tp)    within 5 °C of  the specified classification temperatureσc) 20 Seconds 30 Seconds
Average ramp-down rateσP to Tsmax) 6 °C/ Second  Max. 6°C/ Second  Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

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