CC06H Series High I2t Chip™ 0603 size fuses - 伊顿EATON Bussmann series产品资料中心

Description:
The Chip™ CC06H Series high I2t fuse is a very small surface mount fuse (0603 size) designed to protect low voltage circuits from the harmful effects of short-circuits. The technology of this series combines the robust Bussmann solid matrix fuse construction with advanced fuse element design to deliver state-of-the-art overcurrent protection on circuits subject to inrush currents.

• Halogen free, lead free and RoHS compliant

• High inrush withstand capability
• Fast-acting performance

• Ampacity alpha mark on fuse for easy identification

• Standard termination design for easy solderability

• Compatible with standard lead-free solder reflow and wave soldering processes

• Excellent environmental integrity

Applications

For secondary protection in space constrained applications such as:

• LCD Backlight inverters

• Digital cameras

• DVD Players

• Bluetooth headsets

• Battery packs

Agency information

• cURus Recognized Guide and Card JDXY2/JDYX8, File E19180

Packaging

• TR - Packaging code suffix for tape-and-reel (8mm wide tape on 178mm diameter reel - specification EIA 481-1)

• Quantity = 5000 fuses

Electrical characteristics

Amp Rating	% of Amp Rating	Opening Time
1-8A	100	1 Hours
1-7A	200	1-60 Seconds
1-8A	250	5 Seconds Max

Specifications

Catalog Number	Amp Rating5	Voltage Rating !Vdcl	Interrupting Rating1 4 (amps)	Typical Cold Resistance2 { )	Typical Pre-Arcing3 (1 )	Typïcal Voltage Drop (mV)	Typical Power Dissipation (w)	Alpha Marking	Agency Information (cURus)
CC06H1A	1A	32	50	0.25	0.02	310	0.32	B	X
CC06H1.5A	1.5A	32	50	0.13	0.07	250	0.38	H	X
CC06H2A	2A	32	50	0.068	0.14	170	0.38	K	X
CC06H2.5A	2.5A	32	50	0.05	0.25	155	0.38	L	X
CC06H3A	3A	32	50	0.035	0.3	130	0.38	O	X
CC06H3.5A	4A	32	50	0.023	0.5	100	0.35	R	X
CC06H4Ä	4A	32	50	0.02	0.8	110	0.45	S	X
CC06H5Ä	5A	32	50	0.013	1.6	95	0.48	T	X
CC06HA	6A	32	50	0.0076	2.6	80	0.48	V	X
CC06H7A	7A	32	50	0.0056	3.3	80	0.56	X	X
CC06H8A	8A	32/24	50/90	0.004	4.5	75	0.6	Z	X

1. DC Interrupting Rating (measured at rated voltage, time constant of less than 50 microseconds, battery source).

2. DC Cold Resistance are measured at <10% of rated current in ambient temperature of 20°C - FOR REFERENCE ONLY - CONTROLLED VALUES HELD BY PLANT AND SUBJECT TO CHANGE WITHOUT NOTICE.

3. Typical Pre-arcing I2t are measured at rated DC voltage, 10In current (not to exceed interrupting rating).

4. The insulation resistance after breaking capacity test is higher than 0.1MΩ when measured by 2X rated voltage.

5. Device designed to carry rated current for 4 hours minimum. An operating current 80% or less of rated current is recommended, with further design derating required at elevated ambient temperature. See Temperature Derating Below Curve.

Time-current curves — average melt

I2t vs. time curves

I2t vs. current curves

Temperature derating curve

Dimensions - mm (in)

Pad layout

Product characteristics

Operating temperature	-400 C to 850C with proper derating factor applied
Storage temperature	-400 C to 850C
Load humidity	MIL-STD-202G Method 103B (1000 hr @ 850C / 85% RH & 10% rated current)
Moisture resistance	MIL-STD-202 Method 106E (50 cycles)
Thermal shock	MIL-STD-202 Method 107D (-650C to + 1250 C 100 cycles)
Vibration test	MIL-STD-202 Method 204D Test Condition D (10 000Hz)
Mechanical shock resistance	MIL-STD-202 Method 213B (3000G /0.3ms)
Salt spray resistance	MIL-STD-202 Method 101 Test Condition B (48 hr exposure)
Insulation resistance	The insulation resistance after breaking capacity test is higher than 0.1 MW when measured by 2X rated voltage
Solderability	JESTD-002C Method B1(DlMp and Look Test) Method G1(VVettlngBdance Test) Method D(Reslstance to Dissolution / Dewetting of Metalization)
Resistance to soldering heat	MIL-STD-202 Method 21 OF (Solder dip - 2600 C 60 seconds / Solder Iron - 3500 C 3-5 seconds)
High temperature life test	MIL-STD-202G Method 108A (1000 Hours @ 700 C & 60% rated current)
Resistance to solvents	MIL-STD-202. Method 215K

Solder reflow profile

Reference JDEC J-STD-020D

Profile Feature		Standard SnPb Solder	Lead (Pb) Free Solder
Preheat and Soak	• Temperature min. (Tsminl	100°C	150°C
	• Temperature max. (Tsmax)	150°C	200°C
	• Time (Tsmin to Tsmax) tts)	60-120 Seconds	60-120 Seconds
Average ramp up rate Tsmax to Tp		3°C/ Second Max.	3°C/ Second Max.
Liquidous temperatureσL) Time at liquidous (tL)		183°C 60-150 Seconds	217°C 60-150 Seconds
Peak package body temperatureσp)		Table 1	Table 2
Time (tp) within 5 °C of the specified classification temperatureσc)		20 Seconds	30 Seconds
Average ramp-down rateσP to Tsmax)		6 °C/ Second Max.	6°C/ Second Max.
Time 25°C to Peak Temperature		6 Minutes Max.	8 Minutes Max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.