CC12H Series High I2t Chip™ fuses - 伊顿EATON Bussmann series产品资料中心

Description:

• Halogen free, lead free, RoHS compliant

• High I2t 1206 footprint surface mount fuse

• High inrush withstand capability

• Excellent temperature and cycling characteristics

• RoHS compliant, and lead free and halogen free construction

• Compatible with solder reflow and wave solder

Applications

• Flat panel displays and televisions

• Automotive infotainment and ECU

• Computer servers

• Portable electronics

• Mobile device chargers

Agency information

• cURus Recognition File number: E19180, Guide JDYX2/JDYX8

• AEC-Q200 Automotive Grade Certified

Ordering

• 3000 fuses on 8mm tape-and-reel on a 7 inch (178mm) reel per EIA Standard 481. Specify Catalog Symbol and package code suffix “-TR”(e.g., CC12H1A-TR)

Electrical characteristics

Amp R ating	% of Amp Rating	Opening Time
750mA-20A	100%	4 Hoursmin
1-3A	200%	1-60 Seconds
1-5A	250%	5 Secondsmax
1-5A	300%	0.1-3 Seconds
750mA6-20A	350%	5 Secondsmax
750mA-20A	1000%	0.2-20mS

Environmental data

• Thermal Shock: MIL-STD-202, Method 107, Test Condition B

• Vibration: MIL-STD-202, Method 204, Test Condition C

• Moisture Resistance: MIL-STD-202, Method 106, 50 day cycle

• Solderability: ANSI/J-STD-002, Test B

• Normal ambient temperature: 23°C

• Operating temperature range -40°C to +125°C

Soldering method

• Wave Solder Immersion: 260°C, 10 seconds maximum.

• Solder Reflow: 260°C, 30 seconds maximum.

Specifications

Catalog Symbol	Current Rating (amps)	Voltage Rating (Vdc)	Interrupting Rating" (amps)	Resistance (Q) Typical	Typical Melt !Ft)t DC	Typical Voltage Drop (mV)	Alpha Marking
CC12H750mA	0.75A	63	50	0.780	0.15	840	E
CC12H1A	1A	63	50	0.470	0.18	490	H
CC12H1.5A	1.5A	63	50	0.21 8	0.4	355	K
CC12H2A	2A	63	50	0.133	1.1	305	N
CC12H2.5A	2.5A	63	50	0.079	1.7	240	O
CC12H3A	3A	63	50	0.049	2.2	185	P
CC12H3 5A	3 5A	63	50	0 037	2.7	180	R
CC12H4A	4A	63	50	0 033	3.2	169	S
CC12H4.5A	4.5A	32	100	0 028	4.2	160	X
CC12H5A	5A	32	100	0 023	6.0	140	T
CC12H6A	6A	32	100	0.0155	8.0	140	F
CC12H7A	7A	32	100	0.011	9.0	120	J
CC12H8A	8A	32	100	0.007	12	80	M
CC12H10A	10A	32	100	0.0065	33	90	U
CC12H12A	12A	32	100	0.0045	45	80	W
CC12H15A	15	32	100	0.0030	40	70	Y
CC12H20A	20	32	100	0.0020	50	60	Q

* DC Interrupting Rating (Measured at rated voltage, time constant of less than 50 microseconds, battery source)

** DC Cold Resistance (Measured at 10% of rated current)

† Typical Melting I2t (Measured with a battery bank at rated DC voltage, 10x-rated current, not to exceed interrupting rating, time constant of calibrated circuit less than 50 microseconds)

‡ Typical Voltage Drop (Measured at rated current after temperature stabilizes)

Device designed to carry rated current for four hours minimum. An operating current of 80% or less of rated current is recommended, with further derating required at elevated ambient temperatures.

Dimensions - mm (in)

Pad layout

Time-current curves — 750mA-5A average melt

Time-current curves — 6A-20A average melt

I2t vs. time curves — 750mA-5A

I2t vs. time curves — 6A-20A

I2t vs. current curves — 750mA-5A

I2t vs. current curves — 6A-20A

Solder reflow profile

Reference JDEC J-STD-020D

Profile Feature		Standard SnPb Solder	Lead (Pb) Free Solder
Preheat and Soak	• Temperature min. (Tsminl	100°C	150°C
	• Temperature max. (Tsmax)	150°C	200°C
	• Time (Tsmin to Tsmax)(ts)	60-120 Seconds	60-120 Seconds
Average ramp up rate Tsmax to Tp		3 °C/Second Max.	3 °C/ Second Max.
Liquidous temperature(TL) Time at liquidous (tL)		183°C 60-150 Seconds	217°C 60-150 Seconds
Peak package body temperature(Tp)*		Table 1	Table 2
Time (tp) within 5 °C of the specified classification temperature(Tc)		20 Seconds	30 Seconds
Average ramp-down rate(TP to Tsmax)		6 °C/Second Max.	6 °C/Second Max.
Time 25°C to Peak Temperature		6 Minutes Max.	8 Minutes Max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.