cooper bussmann

CC12H Series High I2t Chip™ fuses

  

Description:
Halogen free, lead free, RoHS compliant
High I2t 1206 footprint surface mount fuse
High inrush withstand capability
Excellent temperature and cycling characteristics
RoHS compliant, and lead free and halogen free construction
Compatible with solder reflow and wave solder

Applications
Flat panel displays and televisions
Automotive infotainment and ECU
Computer servers
Portable electronics
Mobile device chargers
 
Agency information
cURus Recognition File number: E19180, Guide JDYX2/JDYX8
AEC-Q200 Automotive Grade Certified
 
Ordering
3000 fuses on 8mm tape-and-reel on a 7 inch (178mm) reel per EIA Standard 481. Specify Catalog Symbol and package code suffix “-TR”(e.g., CC12H1A-TR)

Electrical characteristics
Amp R ating % of Amp Rating Opening Time
750mA-20A 100% 4 Hoursmin
1-3A 200% 1-60 Seconds
1-5A 250% 5 Secondsmax
1-5A 300% 0.1-3 Seconds
750mA6-20A 350% 5 Secondsmax
750mA-20A 1000% 0.2-20mS


Environmental data
Thermal Shock: MIL-STD-202, Method 107, Test Condition B
Vibration: MIL-STD-202, Method 204, Test Condition C
Moisture Resistance: MIL-STD-202, Method 106, 50 day cycle
Solderability: ANSI/J-STD-002, Test B
Normal ambient temperature: 23°C
Operating temperature range -40°C to +125°C
 
Soldering method
Wave Solder Immersion: 260°C, 10 seconds maximum.
Solder Reflow: 260°C, 30 seconds maximum.

Specifications
Catalog
Symbol
Current Rating
(amps)
Voltage Rating
(Vdc)
Interrupting
Rating" (amps)
Resistance
(Q)      Typical
Typical Melt
!Ft)t DC
Typical Voltage
Drop  (mV)
Alpha
Marking
CC12H750mA 0.75A 63 50 0.780 0.15 840 E
CC12H1A 1A 63 50 0.470 0.18 490 H
CC12H1.5A 1.5A 63 50 0.21 8 0.4 355 K
CC12H2A 2A 63 50 0.133 1.1 305 N
CC12H2.5A 2.5A 63 50 0.079 1.7 240 O
CC12H3A 3A 63 50 0.049 2.2 185 P
CC12H3 5A 3 5A 63 50 0 037 2.7 180 R
CC12H4A 4A 63 50 0 033 3.2 169 S
CC12H4.5A 4.5A 32 100 0 028 4.2 160 X
CC12H5A 5A 32 100 0 023 6.0 140 T
CC12H6A 6A 32 100 0.0155 8.0 140 F
CC12H7A 7A 32 100 0.011 9.0 120 J
CC12H8A 8A 32 100 0.007 12 80 M
CC12H10A 10A 32 100 0.0065 33 90 U
CC12H12A 12A 32 100 0.0045 45 80 W
CC12H15A 15 32 100 0.0030 40 70 Y
CC12H20A 20 32 100 0.0020 50 60 Q
* DC Interrupting Rating (Measured at rated voltage, time constant of less than 50 microseconds, battery source)
** DC Cold Resistance (Measured at 10% of rated current)
† Typical Melting I2t (Measured with a battery bank at rated DC voltage, 10x-rated current, not to exceed interrupting rating, time constant of calibrated circuit less than 50 microseconds)
‡ Typical Voltage Drop (Measured at rated current after temperature stabilizes)
Device designed to carry rated current for four hours minimum. An operating current of 80% or less of rated current is recommended, with further derating required at elevated ambient temperatures.
 
Dimensions - mm (in)


Pad layout


Time-current curves — 750mA-5A average melt


Time-current curves — 6A-20A average melt

 
I2t vs. time curves — 750mA-5A


I2t vs. time curves — 6A-20A


I2t vs. current curves — 750mA-5A


I2t vs. current curves — 6A-20A


Solder reflow profile


Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsminl 100°C 150°C
• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin to Tsmax)(ts) 60-120 Seconds 60-120 Seconds
Average ramp up rate Tsmax to Tp 3 °C/Second Max. 3 °C/ Second Max.
Liquidous  temperature(TL)
Time at liquidous (tL)
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperature(Tp)* Table 1 Table 2
Time (tp)   within 5 °C  of the specified classification temperature(Tc) 20 Seconds 30 Seconds
Average ramp-down rate(TP to Tsmax) 6 °C/Second Max. 6 °C/Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

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