cooper bussmann

FP0807 Series Flat-Pac™ High Current High Frequency Power Inductors

  

Description:
• Halogen free
• 125°C maximum total temperature operation
• 7.4 x 7.6 x 7.0mm surface mount package
• Ferrite core material
• High current carrying capacity, Low core losses
• Controlled DCR tolerance for sensing circuits
• Inductance range from 70nH to 220nH
• Current range from 35 to 108 amps
• Frequency range up to 2MHz
• RoHS compliant

Applications:
• Multi-phase regulators
• Voltage Regulator Module (VRM)
• Desktop and server VRMs and EVRDs
• Notebook regulators
• Data networking and storage systems
• Graphics cards and battery power systems
• Point-of-load modules
• DCR sensing
 
Environmental Data:
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C (Range is application specific)
• Solder reflow temperature: J-STD-020D compliant
 
Packaging:
• Supplied in tape and reel packaging, 600 parts per reel,13” diameter reel

Product Specifications
Part Number7 OCL1  ± 10% (nH) FLL2 Min. (nH) Irms3  (Amps) Isat14  @ 25°C (Amps) Isat25  @ 125°C (Amps) DCR (mΩ) @ 20°C K-factor6
FP0807R1-R07-R 70 50 49 108 79 0.50 ± 6% 520
FP0807R1-R10-R 100 72 77 55 520
FP0807R1-R12-R 120 86 66 48 520
FP0807R1-R16-R 160 115 48 36 520
FP0807R1-R18-R 180 129 42 32 520
FP0807R1-R20-R 200 144 38 28 520
FP0807R1-R22-R 220 158 35 25 520
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1
3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application.
4 Isat1: Peak current for approximately 20% rolloff at +25°C.
5 Isat2: Peak current for approximately 20% rolloff at +125°C.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3, Bp-p : (Gauss),K: (K-factor from table), L: (inductance in nH),ΔI (peak-to-peak ripple current in amps).
7 Part Number Definition: FP0807Rx-Rxx-R
• FP0807 = Product code and size
• Rx is the DCR indicator
• Rxx= Inductance value in μH, R = decimal point
• “-R” suffix = RoHS compliant

Dimensions - mm 

Packaging Information - mm


Temperature Rise vs.Total Loss


Core Loss


Inductance Characteristics


Solder Reflow Profile


Reference JDEC J-STD-020D
Profile  Feature Standard  SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C
• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin to Tsmax) (ts) 60-120  Seconds 60-120  Seconds
Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (TL) Time at liquidous (tL) 183°C
60-150  Seconds
217°C
60-150  Seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds**
Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.

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