cooper bussmann

Flat-Pac™ FP0404 Series High Current High Frequency Power Inductors

  

Description
• High current carrying capacity
• Low core loss
• Frequency range up to 2MHz
• Inductance Range from 22nH to 110nH
• Current range from 14 amps to 40 amps
• 4.0x4.0mm footprint surface mount package in 3.0 and 4.0mm heights
• Ferrite core material
• Halogen free, lead free, RoHS compliant
 
Applications
• Multi-phase and Vcore regulators
• Voltage Regulator Modules (VRMs)
• Server and desktop VRMs and EVRDs
• Laptop and notebook regulators
• Data networking and storage systems
• Graphics cards and battery power systems
• Point-of-Load modules
 
Environmental Data
• Storage temperature range (component): -40°C to +125°C
• Operating temperature range: -40°C to +125°C (ambient plus self-temperature rise)
• Solder reflow temperature: J-STD-020D compliant

Product Specifications
Part Number5 OCL1
(nH) ±15%
FLL2
(nH) minimum
Irms
3
(amps)
Isat14
(amps)
Isat25
(amps)
Isat36
(amps)
DCR (mΩ)
@ 20°C
±25%
K-factor7
FP0404R1-R022-R 22 ±20% 15 19 40 34 32 0.32 ± 15% 2351
FP0404R1-R065-R 65 44 19 24 22 20 0.32 2248
FP0404R1-R080-R 80 54 19 20 18 16 0.32 2248
FP0404R1-R100-R 100 68 19 16 14 13 0.32 2248
FP0404R1-R110-R 110 74 19 14 13 12 0.32 2248
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz (1MHz for R022), 0.1Vrms, 0.0Adc, 25°C
2. Full Load Inductance (FLL) Test Parameters: 100kHz (1MHz for R022), 0.1Vrms, Isat1, 25°C
3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. 
PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C underworst case operating conditions verified in the end application.
4. Isat1 : Peak current for approximately 20% rolloff @ +25°C
5. Isat2 : Peak current for approximately 20% rolloff @ +100°C
6. Isat3 : Peak current for approximately 20% rolloff @ +125°C
7. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ∆I (Peak to peak ripple current in Amps).
8. Part Number Definition: FP0404-Rxxx-R 
 FP0404 = Product code and size 
 Rx= DCR indicator 
 Rxxx=Inductance value in μH, R=decimal point 
-R suffix = RoHS compliant

Dimensions (mm)


Packaging information (mm)
FP0404R1-R022-R
Supplied in tape and reel packaging, 1,800 parts per 13” diameter reel


Packaging information (mm)
FP0404R1-R065-R, R080-R, R100-R, R110-R
Supplied in tape and reel packaging, 1,800 parts per 13” diameter reel


Temperature rise vs. total loss



Core loss
FP0404R1-R022-R

FP0404R1-R065-R, R080-R, R100-R, R110-R

Inductance characteristics







Solder reflow profile


Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C
  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds
Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (Tl)
Time at liquidous (tL)
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds**
Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
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