cooper bussmann

FP1308 Series Flat-Pac™ High Current High Frequency Power Inductors

  
IF NEW DESIGNS, RECOMMENED TO FP1308R3-R SERIES.

Description
• Halogen Free
• 125°C maximum total operating temperature
• 13.7 x 12.9 x 8.0mm surface mount package
• High current handling capability, compact footprint
• Ferrite core material
• Inductance range from 0.110μH to 0.440μH
• Current range from 32 to 120 amps
• Frequency range up to 2MHz

Applications
•Voltage regulator modules (VRMs) for servers and microprocessors
•Multi-phase buck inductors
•High frequency,high current switching power supplies

Environmental Data
•Storage temperature range:-40°C to +125°C
•Operating temperature range:-40°C to +125°C(ambient plus self temperature rise)
•Solder reflow temperature:J-STD-020D compliant

Packaging
•Supplied in tape-and-reel packaging,400 parts per reel,13”diameter reel

Product Specifications
Part
Number5
Rated
Inductance (μH)
OCL1
± 10% (μH)
Irms2
(Amps)
Isat3
(Amps)
DCR (mΩ) @
25°C Typical
DCR (mΩ) @
25°C Max
K-factor4
FP1308-R11-R 0.110 0.110 68 120 0.20 0.24 21.330
FP1308-R21-R 0.210 0.210 68 72 0.20 0.24 21.333
FP1308-R26-R 0.260 0.260 68 60 0.20 0.24 21.335
FP1308-R32-R 0.320 0.320 68 45 0.20 0.24 21.340
FP1308-R44-R 0.440 0.440 68 32 0.20 0.24 21.366
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc
2 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application.
3 Isat: Peak current for approximately 20% rolloff at +25°C.
4 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p (mT): (Gauss), K: (K-factor from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps).
5 Part Number Definition: FP1308-xxx-R
• FP1308 = Product code and size
• xxx= Inductance value in μH, R = decimal point. If no “R” is present, then third character = # of zeros.
• “-R” suffix = RoHS compliant

Dimensions - mm


Part Marking: FP1308
xxx = Inductance value in μH.
(R = Decimal point). If no “R” is present, then last character is # 0f zeros
wwllyy = Date code
R = Revision level
 
Packaging Information - mm

Supplied in tape-and-reel packaging, 400 parts per reel, 13” diameter reel.
 
Temperature Rise vs. Total Loss


Core Loss


Inductance Characteristics


Solder Reflow Profile


Reference JDEC J-STD-020D
Profile  Feature Standard  SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C
• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin to Tsmax) (ts) 60-120  Seconds 60-120  Seconds
Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (TL) Time at liquidous (tL) 183°C
60-150  Seconds
217°C
60-150  Seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds**
Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
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