FP1308 Series Flat-Pac™ High Current High Frequency Power Inductors - 伊顿EATON Bussmann series产品资料中心

　　
IF NEW DESIGNS, RECOMMENED TO FP1308R3-R SERIES.

Description

• Halogen Free

• 125°C maximum total operating temperature

• 13.7 x 12.9 x 8.0mm surface mount package

• High current handling capability, compact footprint

• Ferrite core material

• Inductance range from 0.110μH to 0.440μH

• Current range from 32 to 120 amps

• Frequency range up to 2MHz

Applications
•Voltage regulator modules (VRMs) for servers and microprocessors
•Multi-phase buck inductors
•High frequency,high current switching power supplies

Environmental Data
•Storage temperature range:-40°C to +125°C
•Operating temperature range:-40°C to +125°C(ambient plus self temperature rise)
•Solder reflow temperature:J-STD-020D compliant

Packaging
•Supplied in tape-and-reel packaging,400 parts per reel,13”diameter reel

Product Specifications

Part Number5	Rated Inductance (μH)	OCL1 ± 10% (μH)	Irms2 (Amps)	Isat3 (Amps)	DCR (mΩ) @ 25°C Typical	DCR (mΩ) @ 25°C Max	K-factor4
FP1308-R11-R	0.110	0.110	68	120	0.20	0.24	21.330
FP1308-R21-R	0.210	0.210	68	72	0.20	0.24	21.333
FP1308-R26-R	0.260	0.260	68	60	0.20	0.24	21.335
FP1308-R32-R	0.320	0.320	68	45	0.20	0.24	21.340
FP1308-R44-R	0.440	0.440	68	32	0.20	0.24	21.366

1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc

2 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application.

3 Isat: Peak current for approximately 20% rolloff at +25°C.

4 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p (mT): (Gauss), K: (K-factor from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps).

5 Part Number Definition: FP1308-xxx-R

• FP1308 = Product code and size

• xxx= Inductance value in μH, R = decimal point. If no “R” is present, then third character = # of zeros.

• “-R” suffix = RoHS compliant

Dimensions - mm

Part Marking: FP1308
xxx = Inductance value in μH.
(R = Decimal point). If no “R” is present, then last character is # 0f zeros
wwllyy = Date code
R = Revision level

Packaging Information - mm

Supplied in tape-and-reel packaging, 400 parts per reel, 13” diameter reel.

Temperature Rise vs. Total Loss

Core Loss

Inductance Characteristics

Solder Reflow Profile

Reference JDEC J-STD-020D

Profile Feature		Standard SnPb Solder	Lead (Pb) Free Solder
Preheat and Soak	• Temperature min. (Tsmin)	100°C	150°C
	• Temperature max. (Tsmax)	150°C	200°C
	• Time (Tsmin to Tsmax) (ts)	60-120 Seconds	60-120 Seconds
Average ramp up rate Tsmax to Tp		3°C/ Second Max.	3°C/ Second Max.
Liquidous temperature (TL) Time at liquidous (tL)		183°C 60-150 Seconds	217°C 60-150 Seconds
Peak package body temperature (TP)*		Table 1	Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)		20 Seconds**	30 Seconds**
Average ramp-down rate (Tp to Tsmax)		6°C/ Second Max.	6°C/ Second Max.
Time 25°C to Peak Temperature		6 Minutes Max.	8 Minutes Max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.